SPECIFICATIONS
Mechanical Characteristics
Temperature Range Operating：-40°C to +85°C
Storage：-40°C to +85°C
Operation Life 30,000 hrs
Humidity 95% RH 40°C，96 hrs
Solder Ability After flux 260±5°C for 5±0.5 seconds 95% coverage
Reflow Soldering Heat For SMT Type Reflow zone 260±5°C for 20 seconds max.
Bill of Material
Housing : Polyamide + Glass-Fibe
Housing Cover : Copper Alloy, Nickel Plated
Metal Round Slide : Copper Alloy, Nickel Plated
Infrared Emitting Diodes
Silicon Photo Transistors
DIMENSIONS
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